zh-cnGoodspeed Rss3Fri, 09 Jan 2009 16:09:22 GMTTue, 25 Nov 2008 17:24:43 GMThttp://blog.cechina.cn/liuminpcb/157467/message.aspx<p class="MsoNormal" style="MARGIN: 0cm 0cm 0pt; TEXT-ALIGN: center" align="center"><span style="FONT-SIZE: 9pt; FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">混合信号电路板的设计准则</span><span lang="EN-US" style="FONT-SIZE: 9pt"><?xml:namespace prefix = o ns = "urn:schemas-microsoft-com:office:office" /><o:p></o:p></span></p> <p class="MsoNormal" style="MARGIN: 0cm 0cm 0pt; TEXT-ALIGN: center" align="center"><span style="FONT-SIZE: 9pt; FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">本文出自：</span><span lang="EN-US" style="FONT-SIZE: 9pt"><a href="http://www.pcbinf.com/">http://www.pcbinf.com</a><o:p></o:p></span></p> <p class="MsoNormal" style="MARGIN: 0cm 0cm 0pt"><span style="FONT-SIZE: 9pt; FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">关键字：</span><span lang="EN-US" style="FONT-SIZE: 9pt">PCB</span><span style="FONT-SIZE: 9pt; FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">抄板，电路板抄板，</span><span lang="EN-US" style="FONT-SIZE: 9pt">PCB</span><span style="FONT-SIZE: 9pt; FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">行业，</span><span lang="EN-US" style="FONT-SIZE: 9pt">PCB</span><span style="FONT-SIZE: 9pt; FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">设计</span><span lang="EN-US" style="FONT-SIZE: 9pt"><br></span><span style="FONT-SIZE: 9pt; FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">模拟电路的工作依赖连续变化的电流和电压。数字电路的工作依赖在接收端根据预先定义的电压电平或门限对高电平或低电平的检测，它相当于判断逻辑状态的</span><span lang="EN-US" style="FONT-SIZE: 9pt">“</span><span style="FONT-SIZE: 9pt; FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">真</span><span lang="EN-US" style="FONT-SIZE: 9pt">”</span><span style="FONT-SIZE: 9pt; FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">或</span><span lang="EN-US" style="FONT-SIZE: 9pt">“</span><span style="FONT-SIZE: 9pt; FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">假</span><span lang="EN-US" style="FONT-SIZE: 9pt">”</span><span style="FONT-SIZE: 9pt; FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">。在数字电路的高电平和低电平之间，存在</span><span lang="EN-US" style="FONT-SIZE: 9pt">“</span><span style="FONT-SIZE: 9pt; FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">灰色</span><span lang="EN-US" style="FONT-SIZE: 9pt">”</span><span style="FONT-SIZE: 9pt; FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">区域，在此区域数字电路有时表现出模拟效应，例如当从低电平向高电平</span><span lang="EN-US" style="FONT-SIZE: 9pt">(</span><span style="FONT-SIZE: 9pt; FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">状态</span><span lang="EN-US" style="FONT-SIZE: 9pt">)</span><span style="FONT-SIZE: 9pt; FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">跳变时，如果数字信号跳变的速度足够快，则将产生过冲和回铃反射现象。</span><span lang="EN-US" style="FONT-SIZE: 9pt"><br><span style="mso-spacerun: yes">&nbsp;&nbsp;&nbsp; </span></span><span style="FONT-SIZE: 9pt; FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">对于现代板极设计来说，混合信号</span><span lang="EN-US" style="FONT-SIZE: 9pt"><a href="http://pcbliumin.ue88.com/">PCB<span lang="EN-US" style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'"><span lang="EN-US">抄板</span></span></a></span><span style="FONT-SIZE: 9pt; FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">的概念比较模糊，这是因为即使在纯粹的</span><span lang="EN-US" style="FONT-SIZE: 9pt">“</span><span style="FONT-SIZE: 9pt; FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">数字</span><span lang="EN-US" style="FONT-SIZE: 9pt">”</span><span style="FONT-SIZE: 9pt; FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">器件中，仍然存在模拟电路和模拟效应。因此，在设计初期，为了可靠实现严格的时序分配，必须对模拟效应进行仿真。实际上，除了通信产品必须具备无故障持续工作数年的可靠性之外，大量生产的低成本</span><span lang="EN-US" style="FONT-SIZE: 9pt">/</span><span style="FONT-SIZE: 9pt; FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">高性能消费类产品中特别需要对模拟效应进行仿真。</span><span lang="EN-US" style="FONT-SIZE: 9pt"><br><span style="mso-spacerun: yes">&nbsp;&nbsp;&nbsp; </span></span><span style="FONT-SIZE: 9pt; FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">现代混合信号</span><span lang="EN-US" style="FONT-SIZE: 9pt">PCB</span><span style="FONT-SIZE: 9pt; FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">设计的另一个难点是不同数字逻辑的器件越来越多，比如</span><span lang="EN-US" style="FONT-SIZE: 9pt">GTL</span><span style="FONT-SIZE: 9pt; FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">、</span><span lang="EN-US" style="FONT-SIZE: 9pt">LVTTL</span><span style="FONT-SIZE: 9pt; FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">、</span><span lang="EN-US" style="FONT-SIZE: 9pt">LVCMOS</span><span style="FONT-SIZE: 9pt; FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">及</span><span lang="EN-US" style="FONT-SIZE: 9pt">LVDS</span><span style="FONT-SIZE: 9pt; FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">逻辑，每种逻辑电路的逻辑门限和电压摆幅都不同，但是，这些不同逻辑门限和电压摆幅的电路必须共同设计在一块</span><span lang="EN-US" style="FONT-SIZE: 9pt">PCB</span><span style="FONT-SIZE: 9pt; FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">上。在此，通过透彻分析高密度、高性能、混合信号</span><span lang="EN-US" style="FONT-SIZE: 9pt"><a href="http://www.pcbinf.com/">PCB<span lang="EN-US" style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'"><span lang="EN-US">抄板</span></span></a></span><span style="FONT-SIZE: 9pt; FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">的布局和布线设计，你可以掌握成功策略和技术。</span><span lang="EN-US" style="FONT-SIZE: 9pt"><o:p></o:p></span></p>http://blog.cechina.cn/liuminpcb/157467/message.aspxpcb抄板相关资料 工业电器Sat, 08 Nov 2008 11:47:41 GMThttp://blog.cechina.cn/liuminpcb/151332/message.aspx<p class="MsoNormal" style="MARGIN: 0cm 0cm 0pt"><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">文章整理：</span><span lang="EN-US"><a href="http://www.pcbwork.net">http://www.pcbwork.net</a> </span></p> <p class="MsoNormal" style="MARGIN: 0cm 0cm 0pt; TEXT-INDENT: 21pt"><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">为了彻底解决多层板压制中产生气泡的问题，提高层间黏合力，采用真空层压技术是必然趋势。在定位技术上对</span><span lang="EN-US">4</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">～</span><span lang="EN-US">6</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">层板已普遍采用无销钉定位技术</span><span lang="EN-US">(MASSI</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">。</span><span lang="EN-US">AM)</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">，并应用</span><span lang="EN-US">X</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">射线定位钻孔，提高了多层板定位精度。在加热方式上，除了常用的电加热和热油加热外，德丽科技</span><span lang="EN-US">(</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">珠海</span><span lang="EN-US">)</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">有限公司引进了利用铜箔电阻直接加热的层压技术，不仅大量降低能耗，而且加热均匀提高层压质量。</span> <span lang="EN-US"><br>PCB</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">真空层压机组</span> <span lang="EN-US"><br></span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">　　由于电子技术的飞速发展，促使了印制电路技术的不断发展。</span><span lang="EN-US"><a href="http://pcbkenny.cublog.cn/">PCB<span lang="EN-US" style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'"><span lang="EN-US">板</span></span></a></span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">经由单面</span><span lang="EN-US">-</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">双面一多层发展，并且多层板的比重在逐年增加。多层板表现在向高</span><span lang="EN-US">*</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">精</span><span lang="EN-US">*</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">密</span><span lang="EN-US">*</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">细</span><span lang="EN-US">*</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">大和小二个极端发展。而多层板制造的一个重要工序就是层压，层压品质的控制在多层板制造中显得愈来愈重要。因此要保证多层板层压品质，需要对多层板层压工艺有一个比较好的了解．为此本人就多年的层压实践，对如何提高多层板层压品质在工艺技术上作如下总结：</span> <span lang="EN-US"><br></span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">一、设计符合层压要求的内层芯板。</span> <span lang="EN-US"><br></span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">　　由于层压机器技术的逐步发展，热压机由以前的非真空热压机到现在的真空热压机，热压过程处于一个封闭式系统，看不到，摸不着。因此在层压前需对内层板进行合理的设计，在此提供一些参考要求：</span> <span lang="EN-US"><br></span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">　　</span><span lang="EN-US">1</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">、要根据多层板总厚度要求选择芯板厚度，芯板厚度一致，偏差小，下料经纬方向一致，特别是</span><span lang="EN-US">6</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">层以上多层板，各个内层芯板经纬方向一定要一致，即经方向与经方向重叠，纬方向与纬方向重叠，防止不必要的板弯曲。</span><span lang="EN-US"><br></span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">　　</span><span lang="EN-US">2</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">、芯板的外形尺寸与有效单元之间要有一定的间距，也就是有效单元到板边距离要在不浪费材料的前提下尽量留有较大的空间，一般四层板要求间距大于</span><?xml:namespace prefix = st1 ns = "urn:schemas-microsoft-com:office:smarttags" /><st1:chmetcnv w:st="on" TCSC="0" NumberType="1" Negative="False" HasSpace="False" SourceValue="10" UnitName="mm"><span lang="EN-US">10mm</span></st1:chmetcnv><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">，六层板要求间距大于</span><st1:chmetcnv w:st="on" TCSC="0" NumberType="1" Negative="False" HasSpace="False" SourceValue="15" UnitName="mm"><span lang="EN-US">15mm</span></st1:chmetcnv><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">、层数愈高，间距愈大。</span> <span lang="EN-US"><br></span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">　　</span><span lang="EN-US">3</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">、定位孔的设计，为减少多层板层与层之间的偏差，因此在多层板定位孔设计方面需注意：</span><span lang="EN-US">4</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">层板仅需设计钻孔用定位孔</span><span lang="EN-US">3</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">个以上即可。</span><span lang="EN-US">6</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">层以上多层板除需设计钻孔用定位孔外还需设计层与层重叠定位铆钉孔</span><span lang="EN-US">5</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">个以上和铆钉用的工具板定位孔</span><span lang="EN-US">5</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">个以上。但设计的定位孔，铆钉孔，工具孔一般是层数愈高，设计的孔的个数相应多一些，并且位置尽量靠边。主要目的是减少层与层之间的对位偏差和给生产制造留有较大的空间。对靶形设计尽量满足打靶机自动识别靶形的要求、一般设计为完整圆或同心圆。</span> <span lang="EN-US"><br></span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">　　</span><span lang="EN-US">4</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">、内层芯板要求无开、短、断路、无氧化、板面清洁干净、无残留膜。</span> <span lang="EN-US"><br></span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">二、满足</span><span lang="EN-US">PCB</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">用户要求，选择合适的</span><span lang="EN-US">PP</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">、</span><span lang="EN-US">CU</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">箔配置。</span> <span lang="EN-US"><br></span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">　　客户对</span><span lang="EN-US">PP</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">的要求主要表现在介质层厚度、介电常数、特性阻抗、耐电压、层压板外表光滑程度等方面的要求，因此选择</span><span lang="EN-US">PP</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">时可根据如下方面去选择：</span> <span lang="EN-US"><br></span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">　　</span><span lang="EN-US">1</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">、层压时</span><span lang="EN-US">Resin</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">能填满印制导线的空隙。</span><span lang="EN-US"> <br></span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">　　</span><span lang="EN-US">2</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">、能在层压时充分排除叠片间空气和挥发物。</span><span lang="EN-US"> <br></span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">　　</span><span lang="EN-US">3</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">、能为多层板提供必须的介质层厚度。</span><span lang="EN-US"> <br></span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">　　</span><span lang="EN-US">4</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">、能保证粘结强度和光滑的外表。</span> <span lang="EN-US"><br></span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">　　根据多年的生产经验，我个人认为</span><span lang="EN-US">4</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">层板层压时</span><span lang="EN-US">PP</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">可用</span><span lang="EN-US">7628</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">、</span><span lang="EN-US">7630</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">或</span><span lang="EN-US">7628+1080</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">、</span><span lang="EN-US">7628+2116</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">等配置。</span><span lang="EN-US">6</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">层以上多层板</span><span lang="EN-US">PP</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">选择主要以</span><span lang="EN-US">1080</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">或</span><span lang="EN-US">2116</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">为主，</span><span lang="EN-US">7628</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">主要作为增加介质层厚度用</span><span lang="EN-US">PP</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">。同时</span><span lang="EN-US">PP</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">要求对称放置，确保镜面效应，防止板弯。</span> <span lang="EN-US"><br></span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">　　</span><span lang="EN-US">5</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">、</span><span lang="EN-US">CU</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">箔主要根据</span><span lang="EN-US"><a href="http://www.pcbwork.net/">PCB</a></span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">用户要求分别的配置不同型号，</span><span lang="EN-US">CU</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">箔质量符合</span><span lang="EN-US">IPC</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">标准。</span> <span lang="EN-US"><br></span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">三、内层芯板处理工艺</span> <span lang="EN-US"><br></span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">　　多层板层压时、需对内层芯板进行处理工艺。内层板的处理工艺有黑氧化处理工艺和棕化处理工艺，氧化处理工艺是在内层铜箔上形成一层黑色氧化膜，黑色氧化膜厚度为</span><span lang="EN-US">0</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">．</span><span lang="EN-US">25-4)</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">．</span><span lang="EN-US">50mg</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">／</span><span lang="EN-US">cm2</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">。棕化处理工艺</span><span lang="EN-US">(</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">水平棕化</span><span lang="EN-US">)</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">是在内层铜箔上形成一层有机膜。内层板处理工艺作用有：</span> <span lang="EN-US"><br></span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">　　</span><span lang="EN-US">1</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">、</span><span lang="EN-US">&nbsp;</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">增加内层铜箔与树脂接触的比表面，使二者之间的结合力增强。</span><span lang="EN-US"> <br></span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">　　</span><span lang="EN-US">2</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">、增加融熔树脂流动时对铜箔的有效湿润性，使流动的树脂有充分的能力伸人氧化膜中，固化后展现强劲的抓地力。</span><span lang="EN-US"> <br></span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">　　</span><span lang="EN-US">3</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">、</span><span lang="EN-US">&nbsp;</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">阻绝高温下液态树脂中固化剂双氰胺的分解一水分对铜面的影响。</span> <span lang="EN-US"><br></span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">　　</span><span lang="EN-US">4</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">、使多层板在湿流程工序中提高抗酸能力、预防粉红圈。四、层压参数的有机匹配多层板层压参数的控制主要系指层压</span><span lang="EN-US">"</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">温度、压力、时间</span><span lang="EN-US">"</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">三者的有机匹配。</span> <span lang="EN-US"><br></span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">　　</span><span lang="EN-US">1</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">：温度、层压过程中有几个温度参数比较重要。即树脂的熔融温度、树脂的固化温度、热盘设定温度、材料实际温度及升温的速度变化。熔融温度系温度升高到</span><st1:chmetcnv w:st="on" TCSC="0" NumberType="1" Negative="False" HasSpace="False" SourceValue="70" UnitName="℃"><span lang="EN-US">70</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">℃</span></st1:chmetcnv><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">时树脂开始熔化。正是由于温度的进一步升高，树脂进一步熔化并开始流动。在温度</span><span lang="EN-US">70<st1:chmetcnv w:st="on" TCSC="0" NumberType="1" Negative="True" HasSpace="False" SourceValue="140" UnitName="℃">-140<span lang="EN-US" style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'"><span lang="EN-US">℃</span></span></st1:chmetcnv></span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">这段时间内，树脂是易流体，正是由于树脂的可流性，才保证树脂的填胶、湿润。随着温度逐渐升高，树脂的流动性经历了一个由小变大、再到小、最后当温度达到</span><span lang="EN-US">160<st1:chmetcnv w:st="on" TCSC="0" NumberType="1" Negative="True" HasSpace="False" SourceValue="170" UnitName="℃">-170<span lang="EN-US" style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'"><span lang="EN-US">℃</span></span></st1:chmetcnv></span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">时，树脂的流动度为</span><span lang="EN-US">0</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">，这时的温度称为固化温度。为使树脂能较好的填胶、湿润，控制好升温速率就得很重</span><span lang="EN-US">&nbsp;</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">要，升温速率是层压温度的具体化，即控制何时温度升到多高。升温速率的控制是多层板层压品质的一个重要参数，升温速率一般控制为</span><span lang="EN-US">2<st1:chmetcnv w:st="on" TCSC="0" NumberType="1" Negative="True" HasSpace="False" SourceValue="4" UnitName="℃">-4<span lang="EN-US" style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'"><span lang="EN-US">℃</span></span></st1:chmetcnv></span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">／</span><span lang="EN-US">MIN</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">。升温速率与</span><span lang="EN-US">PP</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">不同型号，数量等密切相关。对</span><span lang="EN-US">7628PP</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">升温速率可以快一点即为</span><span lang="EN-US">2<st1:chmetcnv w:st="on" TCSC="0" NumberType="1" Negative="True" HasSpace="False" SourceValue="4" UnitName="℃">-4<span lang="EN-US" style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'"><span lang="EN-US">℃</span></span></st1:chmetcnv></span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">／</span><span lang="EN-US">min</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">、对</span><span lang="EN-US">1080</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">、</span><span lang="EN-US">2116PP</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">升温速率控制在</span><span lang="EN-US">1</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">．</span><span lang="EN-US">5<st1:chmetcnv w:st="on" TCSC="0" NumberType="1" Negative="True" HasSpace="False" SourceValue="2" UnitName="℃">-2<span lang="EN-US" style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'"><span lang="EN-US">℃</span></span></st1:chmetcnv></span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">／</span><span lang="EN-US">MIN</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">同时</span><span lang="EN-US">PP</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">数量多、升温速率不能太快，因为升温速率过快，</span><span lang="EN-US">PP</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">的湿润性差，树脂流动性大，时间短，容易造成滑板，影响层压品质。热盘温度主要取决于钢盘、钢板、皮牛纸等的传热情况，一般为</span><span lang="EN-US">180<st1:chmetcnv w:st="on" TCSC="0" NumberType="1" Negative="True" HasSpace="False" SourceValue="200" UnitName="℃">-200<span lang="EN-US" style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'"><span lang="EN-US">℃</span></span></st1:chmetcnv></span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">。</span> <span lang="EN-US"><br></span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">　　</span><span lang="EN-US">2</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">：压力、多层板层压压力大小是以树脂能否填充层间空洞，</span><span lang="EN-US">&nbsp;</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">排尽层间气体和挥发物为基本原则。由于热压机分非真空压机和抽真空热压机，因此从压力出发有一段加压。二段加压和多段加压几种方式。一般非真空压机采用一般加压和二段加压。抽真空机采用二段加压和多段加压。对高、精、细多层板通常采用多段加压。压力大小一般根据</span><span lang="EN-US">P&nbsp;P</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">供应商提供的压力参数确定，一般为</span><span lang="EN-US">15<st1:chmetcnv w:st="on" TCSC="0" NumberType="1" Negative="True" HasSpace="False" SourceValue="35" UnitName="kg">-35kg</st1:chmetcnv></span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">／</span><span lang="EN-US">cm2</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">。</span> <span lang="EN-US"><br></span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">　　</span><span lang="EN-US">3</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">：时间、时间参数主要是层压加压时机的控制、升温时机的控制、凝胶时间等方面。对二段层压和多段层压，控制好主压的时机，确定好初压到主压的转换时刻是控制好层压质量好坏的关键。若施加主压时间过早，会导致挤出树脂、流胶太多，造成层压板缺胶、板薄，甚至滑板等不良现象。若施加主压时间过迟，则会造成层压粘结界面不牢、空洞、或有气泡等缺陷。</span></p>http://blog.cechina.cn/liuminpcb/151332/message.aspxpcb抄板相关资料 工业电器Sat, 08 Nov 2008 11:46:32 GMThttp://blog.cechina.cn/liuminpcb/151331/message.aspx<p class="MsoNormal" style="MARGIN: 0cm 0cm 0pt"><span style="COLOR: black; FONT-FAMILY: 宋体; mso-bidi-font-size: 10.5pt; mso-ascii-font-family: Verdana; mso-hansi-font-family: Verdana">产品在大量生产前，必然要先做几个</span><span lang="EN-US" style="COLOR: black; FONT-FAMILY: Verdana; mso-bidi-font-size: 10.5pt"><a href="http://www.pcbon.net/prototype.html"><span lang="EN-US" style="FONT-FAMILY: 宋体; mso-ascii-font-family: Verdana; mso-hansi-font-family: Verdana"><span lang="EN-US">样机</span></span></a></span><span style="COLOR: black; FONT-FAMILY: 宋体; mso-bidi-font-size: 10.5pt; mso-ascii-font-family: Verdana; mso-hansi-font-family: Verdana">出来，这样可以发现我们做出来的产品的问题，而以后在量产的时候改正过来。</span><span style="COLOR: black; FONT-FAMILY: Verdana; mso-bidi-font-size: 10.5pt"> <span lang="EN-US"><br></span></span><span style="COLOR: black; FONT-FAMILY: 宋体; mso-bidi-font-size: 10.5pt; mso-ascii-font-family: Verdana; mso-hansi-font-family: Verdana">电子产品量产所需要的资料有：</span><span lang="EN-US" style="COLOR: black; FONT-FAMILY: Verdana; mso-bidi-font-size: 10.5pt"> <br>1</span><span style="COLOR: black; FONT-FAMILY: 宋体; mso-bidi-font-size: 10.5pt; mso-ascii-font-family: Verdana; mso-hansi-font-family: Verdana">、首先您得有</span><span lang="EN-US" style="COLOR: black; FONT-FAMILY: Verdana; mso-bidi-font-size: 10.5pt">PCB</span><span style="COLOR: black; FONT-FAMILY: 宋体; mso-bidi-font-size: 10.5pt; mso-ascii-font-family: Verdana; mso-hansi-font-family: Verdana">文件，</span><span lang="EN-US" style="COLOR: black; FONT-FAMILY: Verdana; mso-bidi-font-size: 10.5pt">PCB</span><span style="COLOR: black; FONT-FAMILY: 宋体; mso-bidi-font-size: 10.5pt; mso-ascii-font-family: Verdana; mso-hansi-font-family: Verdana">就是印制电路板的意思。也就是说，您得有</span><span lang="EN-US" style="COLOR: black; FONT-FAMILY: Verdana; mso-bidi-font-size: 10.5pt">PCB</span><span style="COLOR: black; FONT-FAMILY: 宋体; mso-bidi-font-size: 10.5pt; mso-ascii-font-family: Verdana; mso-hansi-font-family: Verdana">文件，在电脑里用</span><span lang="EN-US" style="COLOR: black; FONT-FAMILY: Verdana; mso-bidi-font-size: 10.5pt">PROTEL</span><span style="COLOR: black; FONT-FAMILY: 宋体; mso-bidi-font-size: 10.5pt; mso-ascii-font-family: Verdana; mso-hansi-font-family: Verdana">等电路设计软件能打开。有了这个，你就可以交给电路板生产，您所需要的电路板了。</span><span lang="EN-US" style="COLOR: black; FONT-FAMILY: Verdana; mso-bidi-font-size: 10.5pt">&nbsp; <br>2</span><span style="COLOR: black; FONT-FAMILY: 宋体; mso-bidi-font-size: 10.5pt; mso-ascii-font-family: Verdana; mso-hansi-font-family: Verdana">、元件清单。每个元件的封装、规格、厂家等信息。</span><span lang="EN-US" style="COLOR: black; FONT-FAMILY: Verdana; mso-bidi-font-size: 10.5pt"> <br>3</span><span style="COLOR: black; FONT-FAMILY: 宋体; mso-bidi-font-size: 10.5pt; mso-ascii-font-family: Verdana; mso-hansi-font-family: Verdana">、元件布局图。元件焊接的时候，需要的信息。这个地方焊接什么样的元件的一张图。</span><span lang="EN-US" style="COLOR: black; FONT-FAMILY: Verdana; mso-bidi-font-size: 10.5pt"> <br>4</span><span style="COLOR: black; FONT-FAMILY: 宋体; mso-bidi-font-size: 10.5pt; mso-ascii-font-family: Verdana; mso-hansi-font-family: Verdana">、另外呢，就是</span><span lang="EN-US" style="COLOR: black; FONT-FAMILY: Verdana; mso-bidi-font-size: 10.5pt"><a href="http://www.pcbon.net/"><span lang="EN-US" style="FONT-FAMILY: 宋体; mso-ascii-font-family: Verdana; mso-hansi-font-family: Verdana"><span lang="EN-US">电路板</span></span></a></span><span style="COLOR: black; FONT-FAMILY: 宋体; mso-bidi-font-size: 10.5pt; mso-ascii-font-family: Verdana; mso-hansi-font-family: Verdana">芯片内的程序代码。芯片买回来的时候是空的，由编程器将程序代码烧进去的</span><span lang="EN-US" style="mso-bidi-font-size: 9.0pt"><?xml:namespace prefix = o ns = "urn:schemas-microsoft-com:office:office" /><o:p></o:p></span></p>http://blog.cechina.cn/liuminpcb/151331/message.aspxpcb抄板相关资料 工业电器